Organic light-emitting display apparatus and method of manufacturing the same

ABSTRACT

An organic light-emitting display apparatus and a method of manufacturing the same are provided. The organic light-emitting display apparatus includes a substrate, an organic light-emitting device on the substrate, an encapsulation layer covering the organic light-emitting device, and a low adhesive layer covering the encapsulation layer.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/953,688, filed on Jul. 29, 2013, which claims priority to and thebenefit of Korean Patent Application No. 10-2013-0035958, filed on Apr.2, 2013, in the Korean Intellectual Property Office, the disclosure ofwhich is incorporated herein in its entirety by reference.

BACKGROUND

1. Field

The present invention relates to an organic light-emitting displayapparatus and a method of manufacturing the same.

2. Description of the Related Art

In general, an organic light-emitting display apparatus is a displayapparatus including an organic light-emitting device, a pixel electrode,a counter electrode facing the pixel electrode, and an intermediatelayer positioned between the pixel electrode and the counter electrode,wherein the organic light-emitting device includes a light-emittinglayer, for each pixel.

Because an organic light-emitting device included in the organiclight-emitting display apparatus is highly vulnerable to moisture or thelike, the organic light-emitting device may be covered with anencapsulation layer to prevent or substantially prevent externalimpurities or contaminants from penetrating into the organiclight-emitting device.

SUMMARY

An encapsulation layer may be damaged during a manufacturing process ina typical method of manufacturing an organic light-emitting displayapparatus. If the encapsulation layer is damaged, protection by theencapsulation layer of an organic light-emitting device from externalimpurities and contaminants may be reduced.

Embodiments of the present invention provide an organic light-emittingdisplay apparatus capable of preventing, substantially preventing, orreducing damage of an encapsulation layer for protecting an organiclight-emitting device from external impurities during a manufacturingprocess, and a method of manufacturing the same. However, the aboveaspects of the present invention are only examples and the scope of thepresent invention is not limited thereto.

According to an embodiment of the present invention, there is providedan organic light-emitting display apparatus including: a substrate; anorganic light-emitting device on the substrate; an encapsulation layercovering the organic light-emitting device; and a low adhesive layercovering the encapsulation layer.

The low adhesive layer may include fluorine.

A degree of adhesion between an adhesive layer of a temporary protectivefilm and the low adhesive layer may be lower than a degree of adhesionbetween the low adhesive layer and the encapsulation layer.

The encapsulation layer may have a layered structure in which an organiclayer and an inorganic layer are alternatingly arranged such that anoutermost layer in contact with the low adhesive layer is an inorganiclayer.

The organic light-emitting display apparatus may further include a finalprotective film on the low adhesive layer.

Also, the organic light-emitting display apparatus may further include:a functional layer on the low adhesive layer, and the functional layermay include at least one of a polarizing film or a touch film; and afinal protective film on the functional layer.

The low adhesive layer may include at least a portion of productsobtained by reacting tetrafluorocarbon and hydrogen.

According to another aspect of the present invention, there is provideda method of manufacturing an organic light-emitting display apparatusincluding: forming an organic light-emitting device on a substrate;forming an encapsulation layer to cover the organic light-emittingdevice; and forming a low adhesive layer covering the encapsulationlayer.

A degree of adhesion between an adhesive layer of a temporary protectivefilm and the low adhesive layer is lower than a degree of adhesionbetween the low adhesive layer and the encapsulation layer.

The low adhesive layer may include fluorine.

The forming of the encapsulation layer may be forming the encapsulationlayer as a layered structure in which an organic layer and an inorganiclayer are alternatingly arranged such that the inorganic layer is anoutermost layer.

The method may further include attaching a temporary protective film onthe low adhesive layer; removing the temporary protective film; andattaching a final protective film on the low adhesive layer.

The method may further include forming a functional layer including atleast one of a polarizing film or a touch film on the low adhesivelayer, wherein forming the functional layer occurs between the removingof the temporary protective film and the attaching of the finalprotective film.

Forming the low adhesive layer may include reacting tetrafluorocarbonand hydrogen.

Forming the low adhesive layer may include using a chemical vapordeposition method.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and aspects of embodiments of the presentinvention will become more apparent by describing in some detail exampleembodiments of the present invention with reference to the attacheddrawings in which:

FIGS. 1 through 4 are cross-sectional views schematically illustrating amanufacturing process of an organic light-emitting display apparatusaccording to an embodiment of the present invention; and

FIG. 5 is a cross-sectional view schematically illustrating an organiclight-emitting display apparatus according to another embodiment of thepresent invention.

DETAILED DESCRIPTION

Hereinafter, the present invention will be described more fully withreference to the accompanying drawings, in which example embodiments ofthe invention are shown. The invention may, however, be embodied in manydifferent forms and should not be construed as being limited to theembodiments set forth herein; rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the concept of the invention to those of ordinary skill in theart. Also, in the drawings, the sizes of elements may be scaled up ordown for convenience in description. For example, because the thicknessand size of each element in the drawings are arbitrarily illustrated forconvenience in description, the present invention is not limited tothose illustrated.

When an element such as a layer, film, region, or substrate is referredto as being “on” another element, it can be directly on the otherelement or intervening elements may also be present.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items. Expressions such as “atleast one of,” when preceding a list of elements, modify the entire listof elements and do not modify the individual elements of the list.

FIGS. 1 through 4 are cross-sectional views schematically illustrating amanufacturing process of an organic light-emitting display apparatusaccording to an embodiment of the present invention.

According to a method of manufacturing an organic light-emitting displayapparatus according to the present embodiment, an organic light-emittingdevice 300 is formed on a substrate 110 as illustrated in FIG. 1.However, a thin film transistor 200 controlling the presence and degreeof light emission of the organic light-emitting device 300 may be formedbefore the organic light-emitting device 300 is formed.

The substrate 110 may be formed of various suitable materials, such as aglass material, a metallic material, or a plastic material, such aspolyethylene terephthalate (PET), polyethylene naphthalate (PEN), andpolyimide. Another layer, such as a buffer layer 115, may be addedbetween the substrate 110 and the thin film transistor 200. However, thebuffer layer 115 may be formed on or across an entire surface of thesubstrate 110 and may be formed in a patterned form.

When the thin film transistor 200 is formed on the substrate 110, acapacitor (not shown) in addition to the thin film transistor 200 may beformed together with the thin film transistor 200.

First, a semiconductor layer 210 is formed on the buffer layer 115. Thesemiconductor layer 210 may be formed of amorphous silicon, oxide, orpolycrystalline silicon, or may be formed of an organic semiconductormaterial. In one embodiment, the semiconductor layer 210 may include asource region and a drain region that are doped with dopants, and achannel region. Thereafter, a gate dielectric 130 covering thesemiconductor layer 210 is formed, and a gate electrode 220 is formed onthe gate dielectric 130. However, a first capacitor electrode (notshown) may be concurrently (e.g., simultaneously) formed during theformation of the gate electrode 220.

The gate dielectric 130 may be typically formed to cover the entiresurface of the semiconductor layer 210 and the buffer layer 115. In oneembodiment, the gate dielectric layer 130 may be formed in a patternedform (e.g., across only portions of the semiconductor layer 210 and thebuffer layer 115). The gate dielectric 130 may be formed of siliconoxide, silicon nitride, or other insulating organic and inorganicmaterials. The gate electrode 220, for example, may be formed as asingle layer or with multiple layers, and may include one or moreconductive materials such as aluminum (Al), platinum (Pt), palladium(Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium(Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca),molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), or asuitable alloy thereof, in consideration of adhesion with an adjacentlayer, surface flatness of a stacked layer, and processability.

Subsequently, an interlayer dielectric 140 is formed of silicon oxide,silicon nitride, and/or other insulating organic and inorganic materialsto cover the gate electrode 220 and the gate dielectric 130, andportions of the gate dielectric 130 and the interlayer dielectric 140are removed to form a contact hole so as to expose a region (e.g., apredetermined region) of the semiconducting layer 210. The interlayerdielectric 140 may also be partially patterned. Thereafter, sourceelectrode/drain electrodes 230 are formed to contact the semiconductinglayer 210 through the contact hole and thus, the thin film transistor220 may be formed. However, a second capacitor electrode (not shown) maybe concurrently (e.g., simultaneously) formed during the formation ofthe source electrode/drain electrodes 230. Accordingly, a capacitorhaving the first capacitor electrode positioned or located (e.g.,formed) on the same layer as the gate electrode 220 and the secondcapacitor electrode positioned or located (e.g., formed) on the samelayer as the source electrode/drain electrodes 230 may be formed on thesubstrate 110. The source electrode/drain electrode 230, for example,may be formed as a single layer or multiple layers, and may include aconductive material such as Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li,Ca, Mo, Ti, W, and Cu, or a suitable alloy thereof, in consideration ofconductivity and the like.

After the thin film transistor 200 is formed, a protective layer 150 isformed of silicon oxide, silicon nitride, and/or other suitableinsulating organic and inorganic materials to cover the sourceelectrode/drain electrodes 230 of the thin film transistor 200 and theinterlayer dielectric 140. As illustrated in FIG. 1, a planarizationlayer 160 having a substantially flat top surface is formed on theprotective layer 150. The planarization layer 160 may be formed of anacrylic inorganic, a polyimide, or benzocyclobutene (BCB), and may beformed of silicon oxide or silicon nitride. A top portion of theplanarization layer 160 thus formed may be planarized by a suitableplanarization technique such as a mechanical method (such as milling).

After the formation of the planarization layer 160, a via hole is formedin the protective layer 150 and the planarization layer 160 so as toexpose any one of the source electrode/drain electrodes 230 of the thinfilm transistor 200 through the protective layer 150 and theplanarization layer 160. Next, a pixel electrode 310 is formed on theplanarization layer 160 to be electrically coupled to the thin filmtransistor 200 through the via hole. A pixel-defining layer 170 having asingle or multilayer structure is formed of an organic material, such aspolyacrylate and polyimide, or a material, such as a suitable inorganiclayer, so as to expose a portion including a center portion of the pixelelectrode 310.

The pixel electrode 310 may be formed as a (semi) transparent electrodeor a reflective electrode. In a case where the pixel electrode 310 isformed as a (semi) transparent electrode, the pixel electrode 310, forexample, may be formed of indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium gallium oxide(IGO), or aluminum zinc oxide (AZO). In a case where the pixel electrode310 is formed as a reflective electrode, the pixel electrode 310 mayinclude a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir,Cr, or a compound thereof, and a layer formed of ITO, IZO, ZnO, orIn₂O₃. However, the configuration and material of the pixel electrode310 are not limited thereto, and various modifications may be possible.

The pixel-defining layer 170 may define a pixel by having an openingcorresponding to each sub-pixel, i.e., an opening to expose the centerportion of the pixel electrode 310 or the entire pixel electrode 310.Also, the pixel-defining layer 170 may act to prevent (or substantiallyprevent) the generation of arcs at edges of the pixel electrode 310 byincreasing distances between the edges of the pixel electrode 310 and acounter electrode 330 above the pixel electrode 310.

Thereafter, an intermediate layer 320, including a light-emitting layer,is formed, and the counter electrode 330 is subsequently formed so as toat least correspond to the pixel electrode 310 or correspond to most ofthe area of the substrate 110, and thus, an organic light-emittingdisplay apparatus, including the organic light-emitting device 300 thatis electrically coupled to the thin film transistor 200, may bemanufactured.

The intermediate layer 320 positioned or located (e.g., formed) betweenthe pixel electrode 310 and the counter electrode 330 may be formed of alow molecular weight material or a polymer material. In a case where theintermediate layer 320 is formed of a low molecular weight material, theintermediate layer 320 may be formed by stacking or layering a holeinjection layer (HIL), a hole transport layer (HTL), an emission layer(EML), an electron transport layer (ETL), and an electron injectionlayer (EIL) in a single or composite structure. Various suitablematerials including copper phthalocyanine (CuPc),N,N′-di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB), andtris-8-hydroxyquinoline aluminum (Alq3) may be used as an organicmaterial suitable for the intermediate layer 320. The above layers maybe formed by a suitable deposition technique, such as vacuum depositionor laser-induced thermal imaging (LITI).

In a case where the intermediate layer 320 is formed of a polymermaterial, the intermediate layer 320 may have a structure generallyincluding an HTL and an EML, in which poly-(3,4)-ethylene-dihydroxythiophene (PEDOT) or polyaniline (PANI) may be used as the HTL, and apolymer material, such as poly-phenylenevinylenes (PPVs) andpolyfluorenes, may be used as the EML. The above layers may be formed bya suitable deposition technique, such as screen printing, inkjetprinting, or LITI.

However, the intermediate layer 320 is not limited thereto, and theintermediate layer 320 may also have various structures.

The counter electrode 330 may cover a display area (active area) bybeing formed in one piece or a continuous layer in a plurality ofpixels. Herein, the expression “display area” denotes all areas in whichlight may be emitted by an entire organic light-emitting displayapparatus, and for example, may denote all areas except edges of theorganic light-emitting display apparatus on which a controller or thelike is positioned or located. However, in a case where a dead area doesnot exist on an entire surface of the organic light-emitting displayapparatus, the entire surface of the organic light-emitting displayapparatus may be denoted as the display area.

The counter electrode 330 may be in contact with an electrode powersupply line outside of the display area to receive an electrical signalfrom the electrode power supply line. The counter electrode 330 may beformed as a (semi) transparent electrode or a reflective electrode. In acase where the counter electrode 330 is formed as a (semi) transparentelectrode, the counter electrode 330 may include a layer in which Li,Ca, LiF/Ca, LiF/Al, Al, Mg, or a compound thereof is deposited to facethe intermediate layer 320, or an auxiliary electrode or a bus electrodeline formed of a (semi) transparent material, such as ITO, IZO, ZnO, orIn₂O₃. In a case where the counter electrode 330 is formed as areflective electrode, the counter electrode 330, for example, may have alayer including one or more materials of Li, Ca, LiF/Ca, LiF/Al, Al, Ag,and Mg. However, the configuration and material of the counter electrode330 are not limited thereto, and various modifications may be possible.

After the organic light-emitting device 300 is formed on the substrate110, an encapsulation layer 400 is formed to cover the organiclight-emitting device 300, as illustrated in FIG. 2. In one embodiment,the encapsulation layer 400 having a layered structure is formed, inwhich an organic layer 420 and an inorganic layer 410 are alternatinglyarranged (e.g., formed) with the inorganic layer 410 as an outermostlayer.

Because the organic light-emitting device 300 may be easily deterioratedby an external factor, such as external moisture or oxygen, theencapsulation layer 400 may prevent external oxygen or moisture frompenetrating into the organic light-emitting device 300. In this case,because external impurities may penetrate through the encapsulationlayer 400 when the encapsulation layer 400 is formed in a single layerstructure, the encapsulation layer 400 may be allowed to have amultilayer structure. In this case, when the encapsulation layer 400 isformed only as an organic layer or an inorganic layer, oxygen ormoisture may penetrate from the outside through fine passages formed inthe encapsulation layer 400. Therefore, in order not to generate finepassages interconnected to the organic light-emitting device 300 in theencapsulation layer 400, the encapsulation layer 400 may have a layeredstructure in which the organic layer 420 and the inorganic layer 410 arealternatingly stacked, and thus, the generation of the interconnectedfine passages may be prevented, substantially prevented, or reduced.

When the encapsulation layer 400 is formed, the outermost layer of theencapsulation layer 400 may include the inorganic layer 410 by using amaterial such as silicon nitride and/or silicon oxide. The reason forthis is that a mechanical strength of an inorganic layer may be higherthan that of an organic layer.

After the encapsulation layer 400 is formed, a low adhesive layer 510covering the encapsulation layer 400 is formed as illustrated in FIG. 3.The low adhesive layer 510 may include a material in which a degree orlevel of adhesion between the low adhesive layer 510 and anotheradhesive layer that is subsequently formed over the low adhesive layer510 may be lower than a degree or level of adhesion between the adhesivelayer 510 and the encapsulation layer 400. That is, the low adhesivelayer 510 may include a material in which the degree of adhesion betweenanother adhesive layer to be in contact with the low adhesive layer 510at a later time is lower than a degree of adhesion between the lowadhesive layer 510 and the inorganic layer 410, the outermost layer ofthe encapsulation layer 400. In other words, the low adhesive layer 510may adhere more strongly to the encapsulation layer 400 than to anadhesive layer of a temporary protective film 530′ which may be attachedto the low adhesive layer 510 later. For example, the low adhesive layer510 may include fluorine or another suitable low adhesive layermaterial.

The low adhesive layer 510 (e.g., including fluorine) may be formed byreacting tetrafluorocarbon (CF₄) and hydrogen (H₂). In one embodiment,the low adhesive layer 510 may be formed by using a chemical vapordeposition method, and in this case, tetrafluorocarbon is reacted withhydrogen to generate methane (CH₄) and fluorine. Thus, the low adhesivelayer 510, a fluorine layer, or a layer including fluorine, is formed onthe encapsulation layer 400.

In a case where the chemical vapor deposition method is used to form thelow adhesive layer 510, because the inorganic layer 410, the outermostlayer of the encapsulation layer 400, may be formed by using thechemical vapor deposition method and the low adhesive layer 510 may besubsequently formed in the same chamber, the low adhesive layer 510 maybe effectively formed while maintaining relatively high productivity.Because the low adhesive layer 510 is a hydrophobic layer, the lowadhesive layer 510 may effectively prevent or reduce corrosion of theinorganic layer 410 of the encapsulation layer 400 due to moistureduring a subsequent manufacturing process or after completion of themanufacturing of the organic light-emitting display apparatus.

After the formation of the low adhesive layer 510, a temporaryprotective film 530′ may be attached to the low adhesive layer 510, asillustrated in FIG. 4, in order for the organic light-emitting device300 or the encapsulation layer 400 not to be damaged during a subsequentmanufacturing process. After the attachment of the temporary protectivefilm 530′, a subsequent process, e.g., scribing and/or a cleaningprocess, may be performed. Herein, the expression “scribing” denotesthat, in a state of attaching a temporary protective film after aplurality of display areas having an organic light-emitting device as apixel are formed on a mother substrate, and an encapsulation layer and alow adhesive layer are then formed, a plurality of organiclight-emitting display apparatuses are concurrently (e.g.,simultaneously) manufactured by cutting the mother substrate along theoutside of the plurality of display areas.

In a case where the subsequent process, such as scribing and/or acleaning process, is performed, the low adhesive layer 510 or theencapsulation layer 400 may be damaged if the temporary protective film530′ does not exist. Therefore, in order to prevent the damage thereof,the subsequent process may be performed in a state of having thetemporary protective film 530′ attached on the low adhesive layer 510.The temporary protective film 530′ may be removed after the subsequentprocess is performed.

The temporary protective film 530′ may have a structure including alayer formed of a material, such as polyethylene terephthalate, and anadhesive layer coated on one surface of the layer.

Therefore, when the temporary protective film 530′ is attached to anysurface and then detached after the subsequent process has beenperformed, the surface having the temporary protective film 530′attached thereto may be damaged due to the adhesion of the adhesivelayer.

For example, it may be considered that the temporary protective film530′ is attached to the encapsulation layer 400 as illustrated in FIG.2, before the low adhesive layer 510 is formed. In this case, becausethe adhesion between the inorganic layer 410, such as silicon oxideand/or silicon nitride, as the outermost layer of the encapsulationlayer 400 and the adhesive layer of the temporary protective film 530′is high, defects, in which a portion of the inorganic layer 410 isdelaminated by being adhered to the temporary protective film 530′ or asurface of the inorganic layer 410 is damaged, may occur during thedetachment of the temporary protective film 530′ after the subsequentprocess is performed. The defects may eventually cause degradation ofthe performance of the encapsulation layer 400 and may subsequentlycause damage of the organic light-emitting device due to externaloxygen, moisture, or other contaminants reacting or interacting with theorganic light-emitting device.

However, with respect to the method of manufacturing an organiclight-emitting display apparatus, according to the present embodiment,the low adhesive layer 510 is formed on the encapsulation layer 400 andthe temporary protective film 530′ is attached to the low adhesive layer510 as described above. In this case, because the adhesion between theadhesive layer of the temporary protective film 530′ and the lowadhesive layer 510 is lower than the adhesion between the adhesive layerof the temporary protective film 530′ and the inorganic layer 410, thetemporary protective film 530′ may be effectively detached or removedwhile surface damage of the low adhesive layer 510 is minimized duringthe detachment of the temporary protective film 530′ after thesubsequent process is performed.

Therefore, according to the method of manufacturing an organiclight-emitting display apparatus, according to the present embodiment,an organic light-emitting display apparatus having the low adhesivelayer 510 with minimized surface damage may be manufactured by removingthe temporary protective film 530′ as illustrated in FIG. 3.

However, as illustrated in FIG. 5, in one embodiment, a final protectivefilm 530 may be attached to or formed over the low adhesive layer 510after removing the temporary protective film 530′. For example, thefinal protective film 530 may protect a surface of the organiclight-emitting display apparatus by performing a hard coating treatmentwith polyethylene terephthalate, even in the case that a mechanicalimpact from the outside is applied.

In one embodiment, before the final protective film 530 is attachedafter the temporary protective film 530′ has been removed, a functionallayer including at least any one of layers, such as a polarizing filmand a touch film, is formed on the low adhesive layer 510, and the finalprotective film 530 may be attached to the functional layer. In usingthe organic light-emitting display apparatus after the manufacturethereof is completed, the polarizing film may act to prevent or reduce arapid decrease in visibility of an image reproduced in the displayapparatus while external light is incident on the organic light-emittingdisplay apparatus and reflected back therefrom.

While the method of manufacturing an organic light-emitting displayapparatus has been described, embodiments of the present invention arenot limited thereto. For example, an organic light-emitting displayapparatus manufactured by using the same method or a similar method mayalso be included in the scope of the present invention.

The organic light-emitting display apparatus according to an embodimentof the present invention may have a structure as illustrated in FIG. 3.That is, the organic light-emitting display apparatus may include asubstrate 110, an organic light-emitting device 300 positioned orlocated (e.g., formed) on the substrate 110, an encapsulation layer 400covering the organic light-emitting device 300, and a low adhesive layer510 covering the encapsulation layer 400.

The low adhesive layer 510 may include fluorine, and the adhesion of anadhesive layer with the low adhesive layer 510 may be controlled to belower than the adhesion of the adhesive layer with the encapsulationlayer 400. In one embodiment, the encapsulation layer 400 may have alayered structure in which an organic layer 420 and an inorganic layer410 are alternatingly arranged (e.g., formed) so as to allow theinorganic layer 410 to be a portion in contact with the low adhesivelayer 510, wherein the adhesion of the adhesive layer with the lowadhesive layer 510 may be controlled to be lower than the adhesion ofthe adhesive layer with the inorganic layer 410, the outermost layer ofthe encapsulation layer 400. Accordingly, when a temporary protectivefilm is attached to the low adhesive layer 510 during the manufacturingprocess and then detached after a subsequent process has been performed,the temporary protective film may be cleanly detached while the lowadhesive layer 510 is not damaged.

However, because the low adhesive layer 510 including fluorine is ahydrophobic layer, the low adhesive layer 510 may effectively prevent orreduce corrosion of the inorganic layer 410 of the encapsulation layer400 due to moisture or other external contaminants during a subsequentmanufacturing process or after completion of the manufacturing of theorganic light-emitting display apparatus.

As described above, the low adhesive layer 510 may be formed to includeat least a portion of products obtained by reacting CF₄ and H₂, and inone embodiment, the low adhesive layer 510 may be formed by using achemical vapor deposition method. In this case, because the inorganiclayer 410, the outermost layer of the encapsulation layer 400, may beformed by using a chemical vapor deposition method and the low adhesivelayer 510 may be subsequently formed in the same chamber, the lowadhesive layer 510 may be effectively formed while maintainingproductivity.

As illustrated in FIG. 5, an organic light-emitting display apparatusaccording to another embodiment of the present invention may furtherinclude the final protective film 530 positioned or located (e.g.,formed) on the low adhesive layer 510. For example, the final protectivefilm 530 may protect a surface of the organic light-emitting displayapparatus by performing a hard coating treatment with polyethyleneterephthalate, even in the case that a mechanical impact from theoutside is applied.

In one embodiment, before the final protective film 530 is attached, afunctional layer including at least any one of layers, such as apolarizing film and a touch film, is formed on the low adhesive layer510, and the final protective film 530 may be attached to the functionallayer.

According to an embodiment of the present invention, an organiclight-emitting display apparatus capable of preventing or reducingdamage of an encapsulation layer and protecting an organiclight-emitting device from external impurities or contaminants during amanufacturing process, and a method of manufacturing the same may berealized. However, the scope of the embodiments of the present inventionis not limited to such effects.

While the present invention has been shown and described with referenceto example embodiments thereof, it will be understood by those ofordinary skill in the art that various changes in form and details maybe made therein without departing from the spirit and scope of thepresent invention as defined by the following claims, and theirequivalents.

What is claimed is:
 1. A method of manufacturing an organiclight-emitting display apparatus, the method comprising: forming anorganic light-emitting device on a substrate; forming an encapsulationlayer covering the organic light-emitting device; and forming a lowadhesive layer covering the encapsulation layer.
 2. The method of claim1, further comprising attaching a temporary protective film on the lowadhesive layer, wherein a degree of adhesion between an adhesive layerof the temporary protective film and the low adhesive layer is lowerthan a degree of adhesion between the low adhesive layer and theencapsulation layer.
 3. The method of claim 1, wherein the low adhesivelayer comprises fluorine.
 4. The method of claim 1, wherein forming ofthe encapsulation layer comprises forming the encapsulation layer as alayered structure in which an organic layer and an inorganic layer arealternatingly arranged such that the inorganic layer is an outermostlayer.
 5. The method of claim 1, further comprising: attaching atemporary protective film on the low adhesive layer; removing thetemporary protective film; and attaching a final protective film on thelow adhesive layer.
 6. The method of claim 5, further comprising forminga functional layer comprising at least one of a polarizing film or atouch film on the low adhesive layer, wherein forming the functionallayer occurs between the removing of the temporary protective film andthe attaching of the final protective film.
 7. The method of claim 1,wherein forming of the low adhesive layer comprises reactingtetrafluorocarbon and hydrogen.
 8. The method of claim 7, whereinforming the low adhesive layer comprises using a chemical vapordeposition method.